The products are semiconductor laser chips combined with advanced packaging technology. They can be built-in with semiconductor coolers (TEC) and thermistors (NTC), with precise temperature control and stable wavelength. Heated TO is also available for -10℃~50℃.
TO Packaging Laser
Description
Features
TO 56/TO 60 heat dissipation integrated packaging structure
Working temperature range: -40-70℃/-10-50℃
Low threshold, high power
Low power consumption, high reliability
Application
Home Gas Monitoring
Mini Gas Detection Module
Open-Path Gas Detection System
Industrial Sensor Field
Specifications
| Gas | Wavelength (nm) |
| Oxygen | 760 |
| Hydrogen Fluoride | 1273 |
| Ammonia | 1512.2 |
| Acetylene | 1532 |
| Carbon Monoxide | 1567 |
| Hydrogen Sulfide | 1578 |
| Ethane | 1676 |
| Methane | 1650.9 / 1653.7 |
Info Request
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