Thin film platinum thermosensitive chip is based on the characteristic that the resistance value of platinum (Pt) changes with temperature, employing semiconductor integrated circuit fabrication techniques including sputtering, photolithography, etching, laser trimming, packaging, testing, and other processes. This component is a core sensitive component in the field of precision temperature measurement, with advantages such as high temperature measurement accuracy, good stability, high reliability, and wide temperature measurement range. It is widely used in industrial instruments, household appliances, medical electronics, internal combustion locomotives, new energy vehicles, charging piles, aerospace and other fields.
Pt100 Medium Temperature -M2312/M2016/M2320
Description
Features
Long-term stability
High temperature accuracy
Quick response time
Anti-temperature shock
Compact size
Good vibration resistance
Low self-heating effect
Support users customization
Application
Instrumentation
Energy storage
Medical device
Aerospace
Refrigeration plant
Domestic appliance
New energy
Specifications
| Parameter | Specification |
| Nominal resistance | 100Ω |
| Working temperature range | -70℃~+500℃ |
| TCR | 3851ppm/°C |
| Tensile Strength of Leads | ≥9N |
| Lead Type | Platinum nickel composite silk materia |
| Long-term stability | <0.05% at 1000 Hr at 500°C |
| Thermal response time | Boiling water (v=0.4m/s) τ0.5≤0.07s τ0.632≤0.1s Airflow (v=2m/s) τ0.5≤2.5s τ0.632≤4s |
| Recommended working current | ≤1mA |
| Insulation Resistance | Room temperature≥100MΩ 500°C>2MΩ |
| Seismic resistance | 40g |
| Packaging | Plastic vacuum packaging Provide other forms of packaging as required |
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